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A3P060-FGG144I

  • In Stock: 50000
  • Available: 11155

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $96.00000US $96.00
10+US $72.00000US $720.00
30+US $62.40000US $1872.00
100+US $55.20000US $5520.00
500+US $51.84000US $25920.00
1000+US $48.00000US $48000.00

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  • esd
  • as
  • iso14001
  • iso9001
  • D&B
  • Description
  • Alternatives
  • Shopping Guide
Description
General DescriptionProASIC3, the third-generation family of Actel flash FPGAs, offers performance, density, and features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3 devices the advantage of being a secure, low-power, single-chip solution that is live at power-up (LAPU). ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost.
These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools.
Features and BenefitsHigh Capacity
• 15 k to 1 M System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 300 User I/OsReprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
• Live at Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered OffHigh Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI†In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†
• FlashLock® to Secure FPGA ContentsLow Power
• Core Voltage for Low Power
• Support for 1.5 V-Only Systems
• Low-Impedance Flash SwitchesHigh-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock StructureAdvanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold Sparing I/Os‡
• Programmable Output Slew Rate† and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC3 FamilyClock Conditioning Circuit (CCC) and PLL†
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)Embedded Memory†
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
• True Dual-Port SRAM (except ×18)ARM Processor Support in ProASIC3 FPGAs
• M1 and M7 ProASIC3 Devices—Cortex-M1 and CoreMP7 Soft Processor Available with or without Debug
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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