A3PE3000L-FGG484

Features and Benefits Military Temperature Tested and Qualified
• Each Device Tested from –55°C to 125°C Firm-Error Immune
• Not Susceptible to Neutron-Induced Configuration Loss Low Power
• Dramatic Reduction in Dynamic and Static Power
• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power†
• Low Power Consumption in Flash
*Freeze Mode Allows for Instantaneous Entry To / Exit From Low-Power Flash
*Freeze Modeƒ
• Supports Single-Voltage System Operation
• Low-Impedance Switches High Capacity
• 600 k to 3 M System Gates
• Up to 504 kbits of True Dual-Port SRAM
• Up to 620 User I/Os Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
• Live-at-Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off High Performance
• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System Performance
• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit PCI (1.2 V systems) In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
• FlashLock® to Secure FPGA Contents High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
• High-Performance, Low-Skew Global Network
• Architecture Supports Ultra-High Utilization