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  • In Stock: 1870
  • Available: 1253
  • Updated: 12 HRS ago

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $211.77750US $211.78
10+US $183.54050US $1835.41
30+US $166.59830US $4997.95
100+US $152.47980US $15247.98
500+US $148.24425US $74122.13
1000+US $141.18500US $141185.00

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The AMMC-5618-W10 from Broadcom Inc. is a high-performance gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) designed for use in broadband communications, radar systems, and other wireless applications. With its advanced design and exceptional electrical characteristics, the AMMC-5618-W10 offers outstanding performance, reliability, and versatility in demanding RF and microwave circuits.

Key Features:

  1. Wideband Operation: The AMMC-5618-W10 operates over a wide frequency range, typically spanning from 2 GHz to 30 GHz, making it suitable for various broadband applications. Its broad frequency coverage enables flexibility in system design and compatibility with a wide range of RF and microwave components.
  2. High Gain and Low Noise Figure: This MMIC amplifier features high gain and low noise figure characteristics, providing excellent signal amplification with minimal added noise. The high gain ensures sufficient signal strength for reliable communication and detection, while the low noise figure preserves signal integrity and sensitivity in receiver systems.
  3. High Linearity: The AMMC-5618-W10 exhibits high linearity, allowing it to maintain signal integrity and fidelity even in the presence of strong interfering signals or nonlinear distortions. Its linear response ensures accurate signal processing and modulation, making it suitable for communication systems requiring high dynamic range and distortion-free operation.
  4. Integrated Design: Designed as a monolithic integrated circuit, the AMMC-5618-W10 incorporates multiple active and passive components, such as amplifiers, attenuators, and matching networks, on a single semiconductor die. Its integrated design minimizes external component count, simplifies circuit layout, and reduces assembly complexity, resulting in compact and cost-effective RF subsystems.
  5. High Power Handling Capability: With its robust construction and advanced semiconductor technology, the AMMC-5618-W10 can handle high RF power levels without performance degradation or damage. It is capable of delivering significant output power while maintaining signal integrity and reliability, making it suitable for power amplifier stages in transmitter systems.
  6. Broadband Matching: The MMIC amplifier features broadband impedance matching circuits, ensuring optimal power transfer and signal integrity across its operating frequency range. The integrated matching networks enhance efficiency and performance, enabling seamless integration into RF front-end circuits and minimizing signal reflections and losses.
  7. Low Power Consumption: Despite its high-performance capabilities, the AMMC-5618-W10 consumes low power, making it energy-efficient and suitable for battery-powered or portable applications. Its low power consumption helps extend battery life and reduce overall system operating costs, making it ideal for mobile communication and wireless networking devices.


  • Broadband communication systems
  • Microwave radio links
  • Satellite communication terminals
  • Radar and surveillance systems
  • Test and measurement equipment
  • Electronic warfare systems
  • Phased-array antennas
  • Remote sensing and imaging systems
  • Industrial and scientific instrumentation

The AMMC-5618-W10 MMIC amplifier from Broadcom Inc. offers exceptional performance, reliability, and versatility in a wide range of RF and microwave applications. With its wideband operation, high gain, low noise figure, high linearity, integrated design, high power handling capability, broadband matching, and low power consumption, it provides engineers and designers with a reliable and efficient solution for demanding wireless communication and signal processing requirements.


Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.


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