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C161JCLFCAKXQMA1

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  • Description
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Description
Advance Information
Features
• Fully compatible to standard 8051 microcontroller
• Superset of the 8051 architecture with 8 datapointers
• Up to 20 MHz operating frequency
– 375 ns instruction cycle time @16 MHz
– 300 ns instruction cycle time @20 MHz (50 % duty cycle)
• On-chip program memory (with optional memory protection)
– C505(C)(A)-2R : 16K byte on-chip ROM
– C505A-4R/C505CA-4R: 32K byte on-chip ROM
– C505A-4E/C505CA-4E: 32K byte on-chip OTP
– alternatively up to 64k byte external program memory
• 256 byte on-chip RAM
• On-chip XRAM
– C505/C505C : 256 byte
– C505A/C505CA : 1K byte
• 32 + 2 digital I/O lines
– Four 8-bit digital I/O ports
– One 2-bit digital I/O port (port 4)
– Port 1 with mixed analog/digital I/O capability
• Three 16-bit timers/counters
– Timer 0 / 1 (C501 compatible)
– Timer 2 with 4 channels for 16-bit capture/compare operation
• Full duplex serial interface with programmable baudrate generator (USART)
• Full CAN Module, version 2.0 B compliant (C505C and C505CA only)
– 256 register/data bytes located in external data memory area
– 1 MBaud CAN baudrate when operating frequency is equal to or above 8 MHz
– internal CAN clock prescaler when input frequency is over 10 MHz
• On-chip A/D Converter
– up to 8 analog inputs
– C505/C505C : 8-bit resolution
– C505A/C505CA: 10-bit resolution
• Twelve interrupt sources with four priority levels
• On-chip emulation support logic (Enhanced Hooks Technology TM)
• Programmable 15-bit watchdog timer
• Oscillator watchdog
• Fast power on reset
• Power Saving Modes
– Slow-down mode
– Idle mode (can be combined with slow-down mode)
– Software power-down mode with wake up capability through P3.2/INT0 or P4.1/RXDC pin
• P-MQFP-44 package
• Pin configuration is compatible to C501, C504, C511/C513-family
• Temperature ranges: SAB-C505 versions TA = 0 to 70 °C SAF-C505 versions TA = -40 to 85°C SAH-C505 versions TA = -40 to 110°C SAK-C505 versions TA = -40 to 125°C
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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