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EP2S60F672I4

  • In Stock: 7400
  • Available: 55

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $117.00000US $117.00
10+US $91.00000US $910.00
30+US $78.00000US $2340.00
100+US $71.50000US $7150.00
500+US $68.90000US $34450.00
1000+US $65.00000US $65000.00

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Description
[Altera]Introduction
The Stratix® II FPGA family is based on a 1.2-V, 90-nm, all-layer copper SRAM process and features a new logic structure that maximizes performance, and enables device densities approaching 180,000 equivalent logic elements (LEs). Stratix II devices offer up to 9 Mbits of on-chip, TriMatrix™ memory for demanding, memory intensive applications and has up to 96 DSP blocks with up to 384 (18-bit × 18-bit) multipliers for efficient implementation of high performance filters and other DSP functions.
Features
The Stratix II family offers the following features:
• 15,600 to 179,400 equivalent LEs; see Table 1–1
• New and innovative adaptive logic module (ALM), the basic building block of the Stratix II architecture, maximizes performance and resource usage efficiency
• Up to 9,383,040 RAM bits (1,172,880 bytes) available without reducing logic resources
• TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and first-in first-out (FIFO) buffers
• High-speed DSP blocks provide dedicated implementation of multipliers (at up to 450 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters
• Up to 16 global clocks with 24 clocking resources per device region
• Clock control blocks support dynamic clock network enable/disable, which allows clock networks to power down to reduce power consumption in user mode
• Up to 12 PLLs (four enhanced PLLs and eight fast PLLs) per device provide spread spectrum, programmable bandwidth, clock switchover, real-time PLL reconfiguration, and advanced multiplication and phase shifting
• Support for numerous single-ended and differential I/O standards
• High-speed differential I/O support with DPA circuitry for 1-Gbps performance
• Support for high-speed networking and communications bus standards including Parallel RapidIO, SPI-4 Phase 2 (POS-PHY Level 4), HyperTransport™ technology, and SFI-4
• Support for high-speed external memory, including DDR and DDR2 SDRAM, RLDRAM II, QDR II SRAM, and SDR SDRAM
• Support for multiple intellectual property megafunctions from Altera MegaCore® functions and Altera Megafunction Partners Program (AMPPSM) megafunctions
• Support for design security using configuration bitstream encryption
• Support for remote configuration updates
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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