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EPF10K100EBC356-1

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Description
[ALTERA]General DescriptionAltera FLEX 10KE devices are enhanced versions of FLEX 10K devices. Based on reconfigurable CMOS SRAM elements, the FLEX architecture incorporates all features necessary to implement common gate array megafunctions. With up to 200,000 typical gates, FLEX 10KE devices provide the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Features...
• Embedded programmable logic devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device
– Enhanced embedded array for implementing megafunctions such as efficient memory and specialized logic functions
– Dual-port capability with up to 16-bit width per embedded array block (EAB)
– Logic array for general logic functions
• High density
– 30,000 to 200,000 typical gates (see Tables 1 and 2)
– Up to 98,304 RAM bits (4,096 bits per EAB), all of which can be used without reducing logic capacity
• System-level features
– MultiVoltTM I/O pins can drive or be driven by 2.5-V, 3.3-V, or 5.0-V devices
– Low power consumption
– Bidirectional I/O performance (tSU and tCO) up to 212 MHz
– Fully compliant with the PCI Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz
– -1 speed grade devices are compliant with PCI Local Bus Specification, Revision 2.2, for 5.0-V operation
– Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic
– Fabricated on an advanced process and operate with a 2.5-V internal supply voltage
– In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port
– ClockLockTM and ClockBoostTM options for reduced clock delay/skew and clock multiplication
– Built-in low-skew clock distribution trees
– 100% functional testing of all devices; test vectors or scan chains are not required
– Pull-up on I/O pins before and during configuration
• Flexible interconnect
– FastTrack® Interconnect continuous routing structure for fast, predictable interconnect delays
– Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions)
– Dedicated cascade chain that implements high-speed, high-fan-in logic functions (automatically used by software tools and megafunctions)
– Tri-state emulation that implements internal tri-state buses
– Up to six global clock signals and four global clear signals
• Powerful I/O pins
– Individual tri-state output enable control for each pin
– Open-drain option on each I/O pin
– Programmable output slew-rate control to reduce switching noise
– Clamp to VCCIO user-selectable on a pin-by-pin basis
– Supports hot-socketing
• Software design support and automatic place-and-route provided by Altera’s development systems for Windows-based PCs and Sun SPARCstation, and HP 9000 Series 700/800
• Flexible package options
– Available in a variety of packages with 144 to 672 pins, including the innovative FineLine BGATM packages (see Tables 3 and 4)
– SameFrameTM pin-out compatibility between FLEX 10KA and FLEX 10KE devices across a range of device densities and pin counts
• Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM), DesignWare components, Verilog HDL, VHDL, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity, VeriBest, and Viewlogic
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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