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NCP6925AFCT2G

  • In Stock: 13558
  • Available: 13558

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $2.29500US $2.30
10+US $2.06550US $20.66
30+US $1.60650US $48.20
100+US $1.31962US $131.96
500+US $1.26225US $631.13
1000+US $1.14750US $1147.50

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.

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  • Description
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Description
1 A, Low IGND, Very Low Dropout Regulator (VLDO) with/without Enable
The NCP690, NCP691, NCP692, NCV8690 CMOS LDO family provides 1 A of output current with enhanced ESD in either fixed voltage options or an adjustable output voltage from 5.0 V down to 1.25 V. This device is designed for space constrained and portable battery powered applications and offer additional features such as high PSRR, low Quiescent and Ground current consumption, low noise operation, short circuit and thermal protection.
The device is designed to be used with low cost ceramic capacitors and is packaged in the 6−Lead DFN3x3 package.
Features
• Output Voltage Options: Adjustable, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V
– Other Options Possible
• Adjustable Output by External Resistors from 5.0 V down to 1.25 V
• Guaranteed 1 A Output Current
• ±1.5% Output Voltage Tolerance over All Operating Conditions (Adjustable)
• ±2% Output Voltage Tolerance over All Operating Conditions (Fixed)
• Typical Noise Voltage of 50 Vrms without a Bypass Capacitor
• Typical Dropout Voltage of 190 mV at 1 A (Vout = 2.5 V, TJ = 25°C)
• Active Output Discharge
• Active Low Enable Pin (NCP691 Device)
• Active High Enable Pin (NCP692 device)
• Enhanced ESD: 4 kV and 200 V
• NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

These are Pb−Free DevicesApplications
• Laptops and PCI Cards
• Modem Banks and Telecom Boards
• DSP, FPGA, Microprocessor Boards
• Portable, Battery−Power Applications
• Hard Disk Drives
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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