


PC28F00AP30TFA
- Manufacturer's Part No.:PC28F00AP30TFA
- Manufacturer:
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- Sub-Categories:
- Series:Axcell™
- Description:IC FLASH 1G PARALLEL 64EASYBGA
- Datasheet:
- Quantity:Buy NowAdd to Cart
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- Delivery:
- In Stock: 100
- Available: 5100
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $425.34000 | US $425.34 |
10+ | US $368.62800 | US $3686.28 |
30+ | US $334.60080 | US $10038.02 |
100+ | US $306.24480 | US $30624.48 |
500+ | US $297.73800 | US $148869.00 |
1000+ | US $283.56000 | US $283560.00 |
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- Description
- Alternatives
- Shopping Guide
The part number PC28F00AP30TFA corresponds to a flash memory chip manufactured by Micron Technology. Flash memory is a type of non-volatile memory commonly used in electronic devices for data storage, firmware storage, and code execution.
Key Features:
- Type: Flash Memory Chip.
- Capacity: Specifies the storage capacity of the flash memory chip, typically measured in megabits (Mb) or gigabits (Gb).
- Organization: Indicates the organization of the memory array, such as the number of memory cells, pages, and blocks.
- Interface: Specifies the interface protocol used for communication with the flash memory chip, such as parallel or serial interfaces.
- Access Time: The time it takes to access data stored in the flash memory chip, typically measured in nanoseconds (ns) or milliseconds (ms).
- Operating Voltage: The voltage level required for normal operation of the flash memory chip.
- Package Type: Indicates the physical package or housing of the chip, such as TSOP (Thin Small Outline Package) or BGA (Ball Grid Array), which determines its mounting and connectivity options.
- Temperature Range: Specifies the operating temperature range within which the flash memory chip functions reliably.
Applications:
- Embedded Systems: Used in embedded systems such as microcontrollers, digital cameras, and networking equipment for firmware storage and code execution.
- Solid-State Drives (SSDs): Integrated into SSDs for storing operating systems, applications, and user data in computing devices such as laptops and servers.
- Consumer Electronics: Deployed in consumer electronics devices such as smartphones, tablets, and digital media players for data storage and firmware updates.
- Industrial Applications: Utilized in industrial automation systems, automotive electronics, and medical devices for data logging, program storage, and firmware updates.
- Networking Equipment: Integrated into routers, switches, and networking appliances for storing configuration data, firmware images, and logging information.
- Telecommunications: Employed in telecommunications equipment such as base stations and network infrastructure for firmware storage and software updates.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
SHIPPING GUIDE
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Shipping Cost
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Delivery Time
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