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SAK-C161CS-LF CA

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Description
XC87x Variant Devices
The XC87x product family features devices with different configurations, program memory sizes, package options, power supplyvoltage, temperature and quality profiles (Automotive or Industrial), to offer cost-effective solutions for different application requirements.Summary of
Features
The XC87x has the following features:
• High-performance XC800 Core
– compatible with standard 8051 processor
– two clocks per machine cycle architecture (for memory access without wait state)
– two data pointers
• On-chip memory
– 8 Kbytes of Boot ROM
– 256 bytes of RAM
– 3 Kbytes of XRAM
– 64/52 Kbytes of Flash; (includes memory protection strategy)
• I/O port supply at 3.3 V or 5.0 V and core logic supply at2.5 V (generated by embedded voltage regulator)
• Power-on reset generation
• Brownout detection for core logic supply
• On-chip OSC and PLL for clock generation
– Loss-of-Clock detection
• Power saving modes
– slow-down mode
– idle mode
– power-down mode with wake-up capability via RXD or EXINT01)
– clock gating control to each peripheral
• Programmable 16-bit Watchdog Timer (WDT)
• Five ports
– Up to 40 pins as digital I/O
– 8 dedicated analog inputs used as A/D converter input
• 8-channel, 10-bit ADC
• Four 16-bit timers
– Timer 0 and Timer 1 (T0 and T1)
– Timer 2 and Timer 21 (T2 and T21)
• Multiplication/Division Unit for arithmetic operations (MDU)
• CORDIC Coprocessor for computation oftrigonometric, hyperbolic and linear functions
• MultiCAN with 2 nodes, 32 message objects
• Two Capture/compare units
– Capture/compare unit 6 for PWM signal generation (CCU6)
– Timer 2 Capture/compare unit for vaious digital signal generation (T2CCU)
• Two full-duplex serial interfaces (UART and UART1)
• Synchronous serialchannel (SSC)
• On-chip debug support
– 1 Kbyte of monitor ROM (part of the 8-Kbyte Boot ROM)
– 64 bytes of monitor RAM
• Packages: –PG-LQFP-64 –PG-VQFN-48
• Temperature range TA:
– SAF (-40 to 85 °C)
– SAX (-40 to 105 °C)
– SAK (-40 to 125 °C)
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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