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TLV2624IPW

  • Available: 270

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $3.10800US $3.11
10+US $2.79720US $27.97
30+US $2.17560US $65.27
100+US $1.78710US $178.71
500+US $1.70940US $854.70
1000+US $1.55400US $1554.00

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  • Description
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Description

The TLV27x provides a higher performance alternative to the TLC27x series of op-amps.
These devices take the minimum operating supply voltage down to 2.7V over the extended industrial temperature range while adding the rail-to-rail output swing feature.This makes it an ideal alternative to the TLC27x family for applications where rail-to-rail output swings are essential.
The TLV27x also provides 2-MHz bandwidth from only 550μA supply current.
The TLV27x is fully specified for 5V and ±5V supplies.
The maximum recommended supply voltage is 16V.
The devices can be operated from a variety of rechargeable cells from ±8V down to ±1.35V.
The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an attractive alternative for the TLC27x in battery-powered applications.
The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power micro controllers available today.All parts are available in SOIC packaging; the TLV271 is additionally available in the SOT25 package. Two temperature grades are available for the parts; C grade offers 0 to +70°C operating, I grade offers -40°C to +125°C operating.
Features
• High performance alternative to TLC27x series
• Rail to rail output
• Wide bandwidth: 2MHz
• High slew rate: 2.0 V/µs
• Wide range of supply voltages: 2.7V to 16V
• Low supply current: 550µA per channel
• Low input noise voltage: 35nV/√Hz
• Low input bias current: 1pA
• Specified temperature ranges: ▪ 0°C to +70°C: commercial grade ▪ -40°C to +125°C: industrial grade
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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