CS47L35-CWZR
- Manufacturer’s Part#:CS47L35-CWZR
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- Description:IC LOW PRW AUDIO HUB
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- In Stock: 5800
- Available: 15
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $4.72760 | US $4.73 |
10+ | US $4.25484 | US $42.55 |
30+ | US $3.30932 | US $99.28 |
100+ | US $2.71837 | US $271.84 |
500+ | US $2.60018 | US $1300.09 |
1000+ | US $2.36380 | US $2363.80 |
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The CS47L35-CWZR is a highly integrated audio codec IC (Integrated Circuit) manufactured by Cirrus Logic. This IC is designed to provide high-quality audio processing and playback capabilities for a wide range of consumer electronic devices, including smartphones, tablets, portable media players, and wearables. The CS47L35-CWZR integrates multiple audio processing functions, including analog-to-digital conversion (ADC), digital-to-analog conversion (DAC), audio signal processing, and power management, into a single chip solution. This integration simplifies the design process and reduces system complexity, making it ideal for compact and power-efficient audio solutions.
Features:
- Integrated ADC and DAC: Provides analog-to-digital and digital-to-analog conversion for audio signal processing.
- Audio Signal Processing: Includes built-in audio processing algorithms for advanced audio features such as noise reduction, echo cancellation, and equalization.
- High-Quality Audio Playback: Delivers high-fidelity audio playback with low distortion and noise.
- Flexible Input/Output Configurations: Supports multiple input and output channels for stereo and surround sound applications.
- Low Power Consumption: Optimized for low-power operation, extending battery life in portable devices.
- Integrated Power Management: Provides power management functions to optimize power consumption and prolong battery life.
- Comprehensive Connectivity: Interfaces with external audio devices, microcontrollers, and other system components through standard audio interfaces such as I2S (Inter-IC Sound) and SPI (Serial Peripheral Interface).
- Compact Package: Housed in a compact and thermally efficient package for space-constrained designs.
Applications:
- Smartphones and Tablets
- Portable Media Players
- Wearable Devices
- Bluetooth Speakers
- Headphones and Earphones
- Gaming Consoles
- Automotive Infotainment Systems
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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