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DLW5BSM351SQ2L

  • In Stock: 2335
  • Available: 90123

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $4.72120US $4.72
10+US $4.24908US $42.49
30+US $3.30484US $99.15
100+US $2.71469US $271.47
500+US $2.59666US $1298.33
1000+US $2.36060US $2360.60

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Description

The part number DLW5BSM351SQ2L refers to a multilayer ceramic chip inductor manufactured by Murata Electronics. Chip inductors are passive electronic components used in various applications for filtering, impedance matching, and energy storage in electronic circuits.

Key Features:

  • Type: Multilayer Ceramic Chip Inductor.
  • Inductance: Specifies the inductance value of the chip inductor, typically measured in microhenries (µH).
  • Tolerance: The allowed deviation from the nominal inductance value, typically expressed as a percentage.
  • Rated Current: The maximum current that the inductor can carry continuously without exceeding its temperature limits.
  • DC Resistance (DCR): The resistance of the inductor when a DC current is passed through it.
  • Self-Resonant Frequency (SRF): The frequency at which the inductive reactance and the capacitive reactance of the inductor cancel each other out, causing the inductor to behave purely resistive.
  • Operating Temperature Range: Specifies the temperature range within which the inductor operates reliably.
  • Package Type: Surface-mount package suitable for automated assembly processes.
  • RoHS Compliance: Indicates whether the component complies with Restriction of Hazardous Substances (RoHS) regulations.

Applications:

  • RF Circuits: Used in RF circuits for impedance matching, filtering, and resonant tank circuits.
  • DC-DC Converters: Employed in DC-DC converter circuits for energy storage and smoothing of output voltages.
  • Power Amplifiers: Integrated into power amplifier circuits for matching and tuning purposes.
  • Filters: Utilized in filter circuits for suppressing or attenuating unwanted frequencies in signal processing applications.
  • Signal Conditioning: Used in signal conditioning circuits for sensor interface and signal filtering.
  • Communication Systems: Deployed in communication systems such as cellular phones, Wi-Fi routers, and satellite receivers.
 
 

 

 

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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