DLW5BSM351SQ2L
- Manufacturer’s Part#:DLW5BSM351SQ2L
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- Series:DLW5B
- ECAD Model:
- Description:CMC 2A 2LN 350 OHM SMD
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- Quantity:Buy NowAdd to Cart
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- In Stock: 2335
- Available: 90123
Reference Price(In US Dollars)
Qty | Unit Price | Ext.Price |
---|---|---|
1+ | US $4.72120 | US $4.72 |
10+ | US $4.24908 | US $42.49 |
30+ | US $3.30484 | US $99.15 |
100+ | US $2.71469 | US $271.47 |
500+ | US $2.59666 | US $1298.33 |
1000+ | US $2.36060 | US $2360.60 |
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- Description
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- Shopping Guide
The part number DLW5BSM351SQ2L refers to a multilayer ceramic chip inductor manufactured by Murata Electronics. Chip inductors are passive electronic components used in various applications for filtering, impedance matching, and energy storage in electronic circuits.
Key Features:
- Type: Multilayer Ceramic Chip Inductor.
- Inductance: Specifies the inductance value of the chip inductor, typically measured in microhenries (µH).
- Tolerance: The allowed deviation from the nominal inductance value, typically expressed as a percentage.
- Rated Current: The maximum current that the inductor can carry continuously without exceeding its temperature limits.
- DC Resistance (DCR): The resistance of the inductor when a DC current is passed through it.
- Self-Resonant Frequency (SRF): The frequency at which the inductive reactance and the capacitive reactance of the inductor cancel each other out, causing the inductor to behave purely resistive.
- Operating Temperature Range: Specifies the temperature range within which the inductor operates reliably.
- Package Type: Surface-mount package suitable for automated assembly processes.
- RoHS Compliance: Indicates whether the component complies with Restriction of Hazardous Substances (RoHS) regulations.
Applications:
- RF Circuits: Used in RF circuits for impedance matching, filtering, and resonant tank circuits.
- DC-DC Converters: Employed in DC-DC converter circuits for energy storage and smoothing of output voltages.
- Power Amplifiers: Integrated into power amplifier circuits for matching and tuning purposes.
- Filters: Utilized in filter circuits for suppressing or attenuating unwanted frequencies in signal processing applications.
- Signal Conditioning: Used in signal conditioning circuits for sensor interface and signal filtering.
- Communication Systems: Deployed in communication systems such as cellular phones, Wi-Fi routers, and satellite receivers.
Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.
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