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NT5CC256M16ER-EKI

  • Manufacturer’s Part#:
    NT5CC256M16ER-EKI
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  • In Stock: 20000
  • Available: 10000

Reference Price(In US Dollars)

QtyUnit PriceExt.Price
1+US $4.88400US $4.88
10+US $4.39560US $43.96
30+US $3.41880US $102.56
100+US $2.80830US $280.83
500+US $2.68620US $1343.10
1000+US $2.44200US $2442.00

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Description

The NT5CC256M16ER-EKI is a DRAM memory component that typically comes in a Ball Grid Array (BGA) package. This part is a high-performance dynamic random-access memory (DRAM) module designed for fast data access and efficient data storage.

Key Features:

  • Memory Type: DRAM, typically a synchronous DRAM (SDRAM) or a Double Data Rate (DDR) SDRAM variant.
  • Capacity: The part offers a specific memory capacity (e.g., 4 Gb) based on its part number, which may vary depending on the manufacturer's product line.
  • Data Bus Width: Likely supports a data bus width of 16 bits, as indicated by the part number.
  • Operating Frequency: Operates at a specific clock frequency (e.g., 1333 MHz, 1600 MHz), which should be referenced from the datasheet.
  • Low Voltage Operation: Operates at a specified low voltage (e.g., 1.5V or 1.35V for low-power consumption).
  • CAS Latency: Offers a certain CAS latency for efficient data read/write operations (refer to datasheet for specific latency values).
  • Temperature Range: Functions over a range of operating temperatures, typically from -40°C to 85°C.
  • BGA Package: Comes in a compact Ball Grid Array (BGA) package, suitable for high-density mounting on PCBs.

Applications:

  • Computing Devices: Suitable for use in computers, servers, and other computing devices for system memory.
  • Embedded Systems: Can be applied in embedded systems for data storage and processing.
  • Networking Equipment: Useful in networking devices such as routers and switches for fast data access.
  • Consumer Electronics: Can be used in consumer electronics for multimedia, gaming, and other applications.
  • Mobile Devices: Ideal for smartphones, tablets, and other mobile devices where high-speed memory is required.
 
 

 

 

Alternatives

Functional Equivalent (FE) materials, including Fused Filament Fabrication (FFF) form, assembly, and functionally compatible substitute materials.

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